Publications (International)
- Ji Hyeon Kim, Taewaen Lim, Joon Yong Park, Ahyeon Ma, Haeun Jung, Ha Young Kim, Sung Ki Cho*, Hana Yoon* and Ki Min Nam*, "Understanding and improving photoelectrochemical performance of Bi2O3/Bi2S3 composite", New Journal of Chemistry, 2019, 43, 11893-11902.
- Won-Hee Lee, Jinseok Kang, Hyun S. Park, Ki Min Nam*, Sung Ki Cho*, "Photoelectrochemical response of Au-decorated CuBi2O4 photocathode in bicarbonate solution", Journal of Electroanalytical Chemistry, 838 (2019) 172-177.
- Chan Mi Kim, Sung Pil Yoon, Sung Ki Cho*, "Electrochemical study on the decomposition kinetics of molten Li/Na carbonate using Au wire electrode", Journal of Electroanalytical Chemistry, 838 (2019) 148?153.
- Jinseok Kang, Chan Mi Kim, Da Yeong Yu, Yu Seok Ham, Sung Ki Cho*, Jae Jeong Kim, "Octylphenol ethoxylate surfactant as a suppressor in copper electrodeposition", Transactions of the IMF, 97 (1), 2019, 22-27.
- Sung Ki Cho*, Ramavi Akbar, Jinseok Kang, Won-Hee Lee and Hyun S. Park, "Electrodeposited single-crystalline PbCrO4 microrods for photoelectrochemical water oxidation: enhancement of minority carrier diffusion", Journal of Materials Chemistry A, 2018, 6, 13312-13320.
- Byung Keun Kim, Soo-Kil Kim, Sung Ki Cho*, and Jae Jeong Kim*, "Enhanced catalytic activity of electrodeposited Ni-Cu-P toward oxygen evolution reaction", Applied Catalysis B: Environmental, 237 (2018) 409-415.
- Myung Hyun Lee, Yoonjae Lee, Jung Hwan Oh, Young Gyu Kim, Sung Ki Cho*, and Jae Jeong Kim*, "Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler", Journal of The Electrochemical Society, 164 (14) D1051-D1055 (2017).
- Heung Chan Lee, Sung Ki Cho, Hyun S. Park, Ki Min Nam, and Allen J. Bard*, "Visible Light Photoelectrochemical Properties of PbCrO4, Pb2CrO5, and Pb5CrO8", The Journal of Physical Chemistry C, 2017, 121, 17561-17568.
- Heung Chan Lee, Hyun S. Park, Sung Ki Cho, Ki Min Nam, Allen J. Bard*, "Direct photoelectrochemical characterization of photocatalytic H, N doped TiO2 powder suspensions",Journal of Electroanalytical Chemistry, 819 (2018) 38-45.
- Won-Hee Lee, Jinuk Byun, Sung Ki Cho*, and Jae Jeong Kim*, "Effect of Halides on Cu Electrodeposit Film: Potential-Dependent Impurity Incorporation", Journal of The Electrochemical Society, 164(7) D493-D497 (2017).
- Chang Hwa Lee, Tack-Jin Kim, Sungbin Park, Sung-Jai Lee, Seung-Woo Paek, Do-Hee Ahn, Sung Ki Cho, "Effect of cathode material on the electrorefining of U in LiCl-KCl molten salts", Journal of Nuclear Materials, 488 (2017) 210-214.
- Jong Hyeok Seo, Gisang Park, Kyung Hee Oh, Soon Hyung Kang, Heung Chan Lee, Sung Ki Cho*, Ki Min Nam*, "Analysis of charge separation processes in WO3-BiVO4 composite for efficient photoelectrochemical water oxidation", Journal of Electroanalytical Chemistry, 789 (2017) 17-23.
- Sung Ki Cho*, and Jinho Chang, "Electrochemically Identified Ultrathin Water-Oxidation Catalyst in Neutral pH Solution Containing Ni2+ and Its Combination with Photoelectrode", ACS Omega, 2017, 2, 432-442.
- Sung Ki Cho*, Sang-Kwon Lee, Eun-Young Choi, and Jin-Mok Hur, "The Evaluation of Polarized Dynamic Reference Electrode (p- Dyn RE) for LiCl-1 wt.% Li2O Molten Salt at 650 oC: Li+/Li p-Dyn RE versus O2/O2- p-Dyn RE", Journal of The Electrochemical Society, 163 (10) E308-E312 (2016).
- Sung Ki Cho*, Hoe Chul Kim, Myung Jun Kim, and Jae Jeong Kim*, "Voltammetric Observation of Transient Catalytic Behavior of SPS in Copper Electrodeposition Its Interaction with Cuprous Ion from Comproportionation", Journal of The Electrochemical Society, 163 (8) D428-D433 (2016).
- Hoe Chul Kim, Myung Jun Kim, Youngran Seo, Yoonjae Lee, Seunghoe Choe, Young Gyu Kim, Sung Ki Cho*, Jae Jeong Kim*, "Bottom-up filling of TSV-scaled trenches by using step current electrodeposition", ECS Electrochemistry Letters, 4 (10) D31-D34 (2015).
- Sung Ki Cho, Fu-Ren F. Fan, and Allen J. Bard*, "Electrochemical Vapor Deposition (E-CVD) of Semiconductors from Gas Phase with a Solid Membrane Cell", Journal of American Chemical Society, 2015, 137, 6638-6642.
- Myung Jun Kim, Seunghoe Choe, Hoe Chul Kim, Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim*, "Electrochemical behavior of citric acid and its influence on Cu electrodeposition for damascene metallization", Journal of the Electrochemical Society, 162 (8) D354-D359 (2015).
- Myung Jun Kim,Youngran Seo, Hoe Chul Kim, Yoonjae Lee, Seunghoe Choe, Young Gyu Kim, Sung Ki Cho*, and Jae Jeong Kim*, "Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums", Electrochim. Acta, 163 (2015), 174~181.
- Jiyeon Kim, Byung-Kwon Kim, Sung Ki Cho, and Allen J. Bard, "Tunneling Ultramicroelectrode Nanoelectrodes and Nanoparticle collisions", Journal of American Chemical Society, 136 (2014), 8173~8176.
- Jongwoo Park, Insoo Choi, Min Jeong Lee, Myeong Ho Kim, Taeho Lim, Kern H. Park, Jihyun Jang, Seung M. Oh, Sung Ki Cho*, Jae Jeong Kim*, "Effect of fluoroethylene carbonate on electrochemical battery performance and the surface chemistry of amorphous MoO2 lithium-ion secondary battery negative electrodes", Electrochimica Acta, 132 (2014) 338~346.
- Seunghoe Choe , Myung Jun Kim , Hoe Chul Kim , Sung Ki Cho , Sang Hyun Ahn , Soo-Kil Kim, and Jae Jeong Kim, "Degradation of bis(3-sulfopropyl) disulfide and its influence on copper electrodeposition for feature filling", J. Electrochem. Soc., 160 (12), D3179~D3185 (2013).
- Sung Ki Cho, Hyun S. Park, Heung Chan Lee, Ki Min Nam, and Allen J. Bard, "Metal Doping on BiVO4 by Composite Deposition for the Improvement of Photoelectrochemical Water Oxidation", J. Phys. Chem. C., 117, 23048~23056 (2013).
- Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Taeho Lim, Kyung Ju Park, Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim,"Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling", J. Electrochem. Soc., 160 (4), D202~D205 (2013).
- Sung Ki Cho, Fu-Ren F. Fan, and Allen J. Bard, "Electrodeposition of Crystalline and Photoactive Silicon Directly from Silicon Dioxide Nanoparticles in Molten CaCl2 for Photovoltaics Application", Angew. Chem. Int. Ed., 2012, 124 (51), 12740~12744.
- Myung Jun Kim, Taeho Lim, Kyung Ju Park, Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim, "Characteristics of pulse-reverse electrodeposited Cu thin films: Part I. Effects of the anodic step in the absence of an organic additive", J. Electrochem. Soc., 159(9), D538~D543 (2012).
- Jinho Chang, Kevin C. Leonard, Sung Ki Cho, and Allen J. Bard, "Examining Ultramicroelectrodes for Scanning Electrochemical Microscopy by White Light Vertical Scanning Interferometry and Filling Recessed Tips by Electrodeposition of Gold", Anal. Chem., 84(11), 5159~5163 (2012).
- Sung Ki Cho, Myung Jun Kim, Hyo-Chol Koo, Soo-Kil Kim, and Jae Jeong Kim, "An Empirical Relation between the Plating Process and Accelerator Coverage in Cu Superfilling", Bull. Korean Chem. Soc., 33 (5), 1603~1607 (2012).
- Sung Ki Cho, Fu-Ren F. Fan, and Allen J. Bard, "Formation of a Silicon Layer by Electroreduction of SiO2 Nanoparticles in CaCl2 Molten Salt", Electrochim. Acta, 65, (2012) 57-63.
- Sung Ki Cho, Myung Jun Kim, Hyo-Chol Koo, Oh Joong Kwon, and Jae Jeong Kim, "Low-resistivity Cu film electrodeposited with 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonate (DPS) for the application to the interconnection of electronic devices", Thin Soild Films, 520, 2136 (2011).
- Sung Ki Cho, Myung Jun Kim, and Jae Jeong Kim, "MSA as a Supporting Electrolyte in Copper Electroplating for Filling of Damascene Trenches and Through Silicon Vias", Electrochem. Solid State Lett., 14, D52~D56 (2011).
- Sung Ki Cho, Myung Jun Kim, Taeho Lim, Oh Joong Kwon, and Jae Jeong Kim, "Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate", J. Vac. Sci. Technol. B 29, 011004-1~011004-5 (2011).
- Myung Jun Kim, Sung Ki Cho, Hyo-Chol Koo, Taeho Lim, Kyung Ju Park, and Jae Jeong Kim, "Pulse Electrodeposition for Improving Electrical Properties of Cu Thin Film", J. Electrochem. Soc. 157, D564~D569 (2010).
- Sung Ki Cho, Taeho Lim, Hong-Kee Lee, and Jae Jeong Kim, "A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization", J. Electrochem. Soc., 157, D187~D192 (2010).
- Myung Jun Kim, Sung Ki Cho, and Jae Jeong Kim, "Change in the Film Properties According to the Various Electroplating Conditions", ECS Trans. 16(22), 87~92 (2009).
- Hyo-Chol Koo, Sung Ki Cho, Oh Joong Kwon, Myung-Won Suh, Young Im, and Jae Jeong Kim. "Improvement in the oxidation resistance of Cu films by an electroless Co-alloy capping process", J. Electrochem. Soc., 156, D236~D241 (2009).
- Joon-Mo Seo, Sung Ki Cho, Hyo-Chol Koo, Soo-Kil Kim, Oh Joong Kwon, and Jae Jeong Kim, "Thin film silver deposition by electroplating for ULSI interconnect applications", Korean J. Chem. Eng., 26, 265~268 (2009).
- Min Cheol Kang, Yung Jun Kim, Hyo-Chol Koo, Sung Ki Cho, and Jae Jeong Kim, "Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing", Electrochem. Solid-State Lett., 12, H433~H436 (2009).
- Hyo-Chol Koo, Seo Young Kim, Sung Ki Cho, and Jae Jeong Kim, "Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection", J. Electrochem. Soc., 155, D558~D562 (2008).
- Hyo-Chol Koo, Sung Ki Cho, Chang Hwa Lee, Soo-Kil Kim, Oh Joong Kwon, and Jae Jeong Kim, "Silver Direct Electrodeposition on Ru Thin Films", J. Electrochem. Soc., 155, D389~D394 (2008).
- Chang Hwa Lee, Ae Rim Kim, Soo-Kil Kim, Hyo-Chol Koo, Sung Ki Cho, and Jae Jeong Kim, "Two-Step Filling in Cu Electroless Deposition Using a Concentration-Dependent Effect of 3-N,N-Dimethylaminodithiocarbamoyl-1-propanesulfonic Acid", Electrochem. Solid-State Lett., 11, D18~D21 (2008).
- Sung Ki Cho, Jong Kyun Lee, Soo-Kil Kim, and Jae Jeong Kim, "Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects", Electrochem. Solid-State Lett., 10, D116~D119 (2007).
- Seung Hwan Cha, Seung-Soo Kim, Sung Ki Cho, and Jae Jeong Kim,"Copper Bottom-Up Filling by Electroplating Without any Additives on Patterned Wafer", Electrochem. Solid-State Lett., 10, D22~D24 (2007).
- Sung Ki Cho and Jae Jeong Kim, "Leveling with Step Potential in Damascene Cu Electrodeposition", J. Electrochem. Soc., 153, C822~C825 (2006).
- Soo-Kil Kim, Soonsik Hwang, Sung Ki Cho, and Jae Jeong Kim, "Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition", Electrochem. Solid-State Lett., 9, C25-C28 (2006).
- Chang Hwa Lee, Sung Ki Cho, and Jae Jeong Kim, "Electroless Cu Bottom-Up Filling Using 3-N,N-Dimethylaminodithiocarbamoyl-1-propanesulfonic acid", Electrochem. Solid-State Lett., 8, J27~J29 (2005).
- Seung Hwan Cha, Seung-Soo Kim, Sung Ki Cho, and Jae Jeong Kim, "Bottom-Up Filling Using Electrochemical Oxidation on Patterned Wafers", Electrochem. Solid-State Lett., 8, C170~C172 (2005).
- Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim, "Superconformal Cu Electrodeposition Using DPS; A Substitutive Accelerator for Bis(3-sulfopropyl) Disulfide", J. Electrochem. Soc., 152, C330~C333 (2005).
- Soo-Kil Kim, Sung Ki Cho, Jae Jeong Kim, and Young-Soo Lee, "Superconformal Cu Electrodeposition on Various Substrates", Electrochem. Solid-State Lett., 8, C19~C21 (2005).
- Sung Ki Cho, Soo-Kil Kim, Hee Han, Jae Jeong Kim, and Seung Mo Oh, "Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrier", J. Vac. Sci. Technol., B 22, 2649~2653 (2004).
Publications (Domestic)
- Yu Seok Ham, Sung Ki Cho*, and Jae Jeong Kim*, "Cu seed damage by insoluble anode", Korean Journal of Chemical Engineering, 34 (5), 1490-1494 108-113 (2016).
- Sung Ki Cho*, and Jae Jeong Kim*, "Study on the Deposit Uniformity and Profile Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication", Korean Chem. Eng. Res., 54(1), 108-113 (2016).
- Joon-Mo Seo, Sung Ki Cho, Hyo-Chol Koo, Soo-Kil Kim, Oh Joong Kwon, and Jae Jeong Kim, "Thin film silver deposition by electroplating for ULSI interconnect applications", Korean Journal of Chemical Engineering, 26 (1), 265-268.
- Oh Joong Kwon, Sung Ki Cho, and Jae Jeong Kim*, "Electrochemical Metallization Processes for Copper and Silver Metal Interconnection", Korean Chem. Eng. Res., 47(2), 141~149 (2009).
- Soo-Kil Kim, Min Cheol Kang, Hyo-Chol Koo, Sung Ki Cho, Jae Jeong Kim*, and Jong-Kee Yeo, "Cu Metallization for Giga Level Devices Using Electrodeposition", Journal of the Korean Electrochemical Society, 10, 94~103 (2007).